| SirectTM, is a leading designer and ODM/OEM service
provider in the discrete power semiconductor field. The major
product is power discrete device (including Diodes, Schottkys,
MOSFETs, SCRs, Transistors, IGBTs, Thyristors and ESD protection
devices) for the industrial, consumer, computer, telecommunication
and automotive applications. It is a global joint venture group,
with facilities located in America and Asia (Taiwan, Philippines
and China), which function as design centers, manufacturing
plants, marketing and sales offices.
Based in U.S.A. and Taiwan, the research and design company
partnered with several global semiconductor suppliers of semiconductor
components with the aim of developing high-density and high-efficiency
power devices, and the team-up has generated a dynamic synergy
that resulted in several new advancements in the assembly
process, design, and packaging of power devices suitable for
the advanced requirements of today¡¯s every-growing market.
The main base of its manufacturing operations is in the Asian
region, such as in Taiwan, China and Philippines, with factories
boasting of manufacturing and assembly facilities and wafer
FAB lines. The plants have positioned themselves as engineering-driven,
product-oriented manufacturers and have assembly and testing
process capabilities for various microelectronic packages.
To-date, several new versions of ESD Protection Devices and
Low VF Trench Schottkys, to name a few, has already been designed
or are currently under development in our design center. A
new, compact surface mount package, called the TO-277 and
PQFN, has also been jointly developed. The high density power
package design enables Sirect to produce high-power, low forward
voltage drop, low thermal resistance, high-average forward
rectified current devices in a low and thin outline ideal
for miniaturized design of power management.